Description
Product Title In Arabic: قصدير لحام خالي من الرصاص 99.3% – جادايفير
High-purity lead-free solder wire composed of 99.3% tin with 0.7% copper, 1.0 mm diameter, 50 g roll. Ideal for electronics and electrical work, offering smooth flow and reliable bonding.
Key Features:
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Lead-free alloy: 99.3% tin (Sn) and 0.7% copper (Cu)
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1.0 mm diameter and 2.2% flux content for clean, consistent joints
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Melting point: 227 °C; recommended solder iron temperature: 370–430 °C
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Packaged in a 50 g color box, compact for storage
Specifications:
| Specification |
Value |
| Diameter |
1.0 mm |
| Net Weight |
50 g |
| Composition |
99.3% Sn (tin), 0.7% Cu (copper) |
| Flux Content |
2.2% |
| Melting Point |
227 °C |
| Recommended Soldering Tip Temp |
370–430 °C |
| Packaging |
Color box |
